Low-cost Electroformed Stencil for Advanced Microelectronic Packaging

Low-cost Electroformed Stencil for Advanced Microelectronic Packaging

ERPE has developed a low-cost microfabrication technique for the manufacture of electroformed stencils. Stencils are used to create ultra-fine electrical and mechanical interconnects for microelectronics devices. The ERPE research led to the formation of the company, Microstencil Ltd, who have brought this technology to market and enabled the commercialisation of such stencils under the DEK brand to customers such as TDK, Optos, Texas Instruments and Osram. Stencil printing provides cost effective packaging solutions for smaller, lighter and smarter portable electronic devices that require increasingly advanced electronic packaging solutions.

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Monday, 5 May, 2014 - 13:30